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About Us
We are supplying ultrasonic micro hole drilling machine, it can make grooving and irregular shape also.The processing minimum hole’s diameter : ø0.10 mm, the maximum thickness for Si substrate is 20mm and for SiC is 8-10mm.
Applied Material: Si, SiC, fine ceramic (alumina, zirconia, AlN…), sapphire,
graphite, quartz/glass, and so on.
Application: Etching chamber top & bottom electrode, shower head, ESC(Electrostatic chuck), silicon wafer, glass/quartz wafer,
lens, fine ...
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